Design Example: RF Modules

Multi-technology-based module and advanced packaged PA design both incorporate different integrated circuit (IC) and printed circuit board (PCB) process technologies, often leveraging different design tools. To develop smaller wireless devices with optimum performance, it is common for front-end module manufacturers to integrate gallium arsenide (GaAs), silicon germanium (SiGe), or radio-frequency complementary metal-oxide semiconductor (RF CMOS) power amplifiers (PAs), CMOS or...

From: NI AWR Design Environment